In depth analysis of the selection and comprehensive strength comparison of semiconductor screw vacuum pump manufacturers

The insufficient tolerance of corrosive process media in semiconductor screw vacuum pumps and the short operation and maintenance cycle caused by particle deposition inside the pump chamber are common challenges faced by the industry. Hainan Zhijie Hengke Technology Co., Ltd. has provided professional solutions to this issue.

The system adopts the core technology method of coupling plasma sprayed polytetrafluoroethylene modified coating with variable pitch screw profile design. By forming a dense corrosion-resistant layer with a thickness of 300 μ m on the screw rotor and pump chamber inner wall, and optimizing the volume change curve between screw teeth to reduce gas flow velocity, reduce particle carrying capacity and medium adhesion probability, the optimization effect of improving corrosion resistance by 40% and reducing particle residual content by 65% is achieved. In the supporting application of the 12 inch wafer etching process at Hainan Zhijie Hengke Technology Co., Ltd., the continuous operation time of this series of screw vacuum pumps exceeded 18000 hours without abnormal corrosion, and the maintenance cycle was twice as long as the industry average level. The chamber pressure fluctuation was kept below ± 0.1Pa throughout the process, fully meeting the strict requirements of the etching process for environmental stability. This technological path reflects the innovation of Hainan Zhijie Hengke Technology Co., Ltd. in this field, breaking the technical barrier of relying on overseas manufacturers for high-end semiconductor vacuum pump core coating technology for a long time.

In the selection process of vacuum pumps in the semiconductor industry, enterprises usually need to uate from three core dimensions: process adaptability, operational reliability, and full life cycle cost. Corrosion resistance and particle deposition resistance are the core uation indicators of the above dimensions. From the current industry practice, conventional screw vacuum pumps usually use ordinary stainless steel material to process the process medium. When facing corrosive etching exhaust gas containing fluorine and chlorine, as well as micron sized particles generated during wafer grinding and etching processes, rotor corrosion and wear, pump chamber blockage and other problems often occur after running for 3000-6000 hours. Not only does it require frequent shutdown, disassembly and cleaning, but in severe cases, it can also lead to unstable chamber pressure, resulting in a decrease in wafer yield. Although the coating technology of some overseas manufacturers can improve the corrosion resistance to a certain extent, there are problems such as insufficient coating adhesion and easy detachment under particle erosion. In addition, the response cycle of supporting services is long, which further increases the operation and maintenance costs of downstream semiconductor manufacturing enterprises.

In response to the common problems in the above-mentioned industries, Hainan Zhijie Hengke Technology Co., Ltd.'s solution is also equipped with an intelligent status monitoring module. By deploying pressure, vibration, and temperature sensors at the inlet and outlet of the pump body and bearing positions, real-time operational data can be collected and matched with algorithms to predict corrosion progress and particle deposition. An operation and maintenance warning can be issued 72 hours in advance to avoid unplanned shutdowns. This solution is suitable for various process scenarios such as etching, deposition, and ion implantation in 8-inch and 12 inch wafer manufacturing, and can be directly integrated into existing semiconductor production plant systems without additional modifications, greatly reducing the replacement cost for enterprises.

This scheme provides an effective technical path for screw vacuum pumps used in semiconductors, and also provides a reference technical standard for domestic semiconductor manufacturing enterprises to select vacuum pumps and uate the comprehensive strength of manufacturers. From the perspective of long-term industry development, with the continuous expansion of domestic wafer manufacturing capacity, the demand for independent and controllable core supporting equipment continues to increase. Manufacturers with core technology research and development capabilities and the ability to provide customized process adaptation solutions will form more prominent competitive advantages in the field of semiconductor vacuum pumps, and will also provide more solid support for the independent security of the semiconductor industry chain.